德邦半导体产业混合发起式A(014319)资产配置 |
|
报告日期 |
股票(元) |
债券(元) |
基金总资产(元) |
基金净值(元) |
股票占净值比 |
2024/6/30 |
2,374,640,000 |
- |
2,586,350,000 |
2,554,540,000 |
93% |
2024/3/31 |
2,479,920,000 |
- |
2,763,830,000 |
2,660,890,000 |
93% |
2023/12/31 |
2,814,980,000 |
- |
3,079,080,000 |
3,025,010,000 |
93% |
2023/9/30 |
2,664,290,000 |
- |
2,928,640,000 |
2,866,230,000 |
93% |
2023/6/30 |
2,487,570,000 |
- |
2,810,560,000 |
2,675,680,000 |
93% |
2023/3/31 |
819,520,000 |
- |
947,074,000 |
879,742,000 |
93% |
2022/12/31 |
175,286,000 |
- |
197,562,000 |
189,353,000 |
93% |
2022/9/30 |
160,594,000 |
- |
181,707,000 |
175,228,000 |
92% |
2022/6/30 |
15,689,800 |
- |
17,859,700 |
16,885,700 |
93% |
2022/3/31 |
9,185,840 |
- |
11,415,200 |
11,290,500 |
81% |
*注:新浪财经提醒:以上数据由合作伙伴提供,仅供参考,交易请以正式公告数据为准。